Industrial Generic Technology Services

Industry common technology services

Pan-Semiconductor Advanced Printed Manufacturing Platform

Led by Professor Deng Weiwei from the Department of Mechanics and Aerospace Engineering at Southern University of Science and Technology, we have introduced core equipment such as environmental atmosphere control printing equipment, chip packaging printing equipment, and full-size industrial grade PCB printing equipment. We aim to build the ability to stably print droplets within the volume range of flight upgrade to skin upgrade, the ability to adapt ink well, and the ability to achieve high-speed and high-precision printing. We provide services such as technology research and development, sample production and testing, process optimization and transformation, customized solutions, technical consulting and training.

Ultra uniform micro droplet generation technology and industrial application

Cooperated with TSI, a leading aerosol instrument company, to provide the core technology of TSI-1520 monodisperse droplet/aerosol generator.

Refined flow field testing and aerodynamic wind tunnel platform

The advanced aerodynamic wind tunnel of Southern University of Science and Technology has a total investment of about 30 million yuan. The experimental section is 0.6 meters wide, 0.55 meters high, and 2.0 meters long, with a maximum wind speed of 80 meters per second and a background turbulence level of less than 0.15% (open section).

Key Laboratory

Southern University of Science and Technology Municipal Key Laboratory

High performance computing cluster of Southern University of Science and Technology

The supercomputing platform has two high-performance clusters, "Taiyi" and "Qiming". Total CPU core count of 43000, dual precision computing capability>3.5 Pflops, storage capacity of 6.6 PB.

The first non defense university in China

Representative equipment

Main service functions

Targeting the high-precision printing manufacturing needs in the fields of pan semiconductor, advanced PCB manufacturing, ultra high definition video display, advanced packaging, and flexible electronics. Build a public technology service platform for advanced semiconductor printing manufacturing to solve the technical bottlenecks faced by enterprises in high-resolution nozzles, functional ink adaptation, and high-speed high-precision printing processes. To address the issue of resource scarcity, promote breakthroughs in the localization of core components and collaborative innovation in the industry, and contribute to the high-quality development of the pan semiconductor industry.

Manual consultation